GTI Device Certification
Certified Products
BG36
Chipset:Qualcomm 9206
Size: 26.5mm * 22.5mm * 2.3mm
MO-2019-0001-P Certification Report for NB-IoT Communication Module-BG36
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FT780-ZMB8
Chipset:ZX297100
Size:18*16*2.3mm
MO-2018-0013-P_Certification_Report_for_NB-IoT_Communication_Module-FEATCHINA_FT780-ZMB8
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ML5535
Chipset:Boudica150 
Size:16.0mm*18.0mm*2.5mm
MO-2018-0012-P_Certification_Report_for_NB-IoT_Communication_Module-CHEERZING_ML5535
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BC35-G
Chipset:Boudica150 
Size:23.6mm*19.9mm*2.2mm
MO-2018-0011-P_Certification_Report_for_NB-IoT_Communication_Module-QUECTEL_BC35-G
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BC28
Chipset:Boudica150 
Size:17.7mm*15.8mm*2.0mm
MO-2018-0010-P Certification­_Report_for_NB-IoT_Communication_Module-QUECTEL_BC28
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BC 26
Chipset: MT2625
Size: 17.7*15.8*2.0 mm
MO-2018-0001-P_Certification_Report_for_NB-IoT_Communication_Module-QUECTEL-BC26
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SIM7020C
Chipset: MT2625
Size: 17.6*15.7*2.3mm
MO-2018-0002-P_Certification_Report_for_NB-IoT_Communication_Module-SIM7020C
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M5310
Chipset: Boudica120
Size:19*18.4*2.7mm
MO-2018-0005-P_Certification_Report_for_NB-IoT_Communication_Module-M5310
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M5311
Chipset: MT 2625
MO-2018-0006-P_Certification_Report_for_NB-IoT_Communication_Module-M5311
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