Samsung has announced the Exynos ModAP quad-core LTE Modem-AP solution with advanced LTE connectivity, the latest in its range of Exynos processors, Telecompaper.com reported on July 11, 2014. Built using a 28 nm HKMG processor, the chipset supports 4G LTE Release 9 of 3GPP and Cat 4, at duplex mode, FDD and TDD, as well as 2G and 3G. The chip features low-power consumption and supports high-resolution video and playback (8MP 30 FPS), plus up to 6.4 Gbps memory bandwidth for graphically intensive apps. Samsung also announced the Exynos Modem 300 series supporting LTE-Advanced Carrier Aggregation and an Exynos RF companion chip supporting enhanced connectivity with LTE. No availability or pricing details are available at this time.